Dr. Yanpeng Gong

Aktuelle Kontaktadresse

Land	China, VR
Ort	Beijing
Universität/Institution	Beijing University of Technology (BJUT)
Institut/Abteilung	Faculty of Materials and Manufacturing

Fachgebiet	Mechanik
Keywords	interfacial delamination, multiscale structures, multilevel interconnect structure, electronic packaging, Isogeometric boundary element method